Carrier tape for tab-package and manufacturing method thereof

ABSTRACT

The present invention relates to a method for manufacturing a TAB tap. The method includes forming a circuit pattern region having input/output terminal pattern on a base film, and forming an exposing region at a convey region having a sprocket hole for exposing the base film. Accordingly, the present invention provides a TAB tape that improves reliability of a product by fundamentally preventing the generation of metal particles by forming exposing regions that expose a base film through selectively etching and removing a metal layer of a convey region formed at both side of a TAB tape and having a sprocket hole, and that prevents short-circuit by partially removing a base film at a predetermined region not having a circuit pattern formed thereon through etching.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit under 35 U.S.C. §119 of KoreanPatent Application No. 10-2010-0096018, filed Oct. 1, 2010, which ishereby incorporated by reference in its entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a Tape Automated Bonding (TAB) tape anda method for manufacturing the same.

2. Description of the Background Art

Many technologies have been introduced for semiconductor packages. Amongthem, a Tape Automated Bonding (TAB) technology has been receivingattention as a chip mounting method using an Inner Lead Bonding (ILB)technology. The TAB technology is a technology for continuouslyprocessing a package assembling process in a reel to reel manner.Typically, a package manufactured using the TAB technology is referredas a TAB package.

FIG. 1 is a diagram illustrating a TAB tape for a typical TAB package.

As shown, the TAB tape includes a metal plating layer S exposed at aregion S where sprocket holes 29 formed thereon. Such a metal platinglayer is essentially formed of a Cu layer or a Cu+Sn layer by carryingout a metal plating process on an insulating film during a process offorming a circuit pattern. After forming the circuit pattern, a Cu metallayer is formed around the sprocket holes, thereby exposing the metallayer.

As described above, the TAB tape of the typical TAB package includes aconductive metal layer such as a Cu layer or a Cu+Sn layer on one sideof a base film. Accordingly, a scratch is essentially formed on thesurface of the Cu layer or the Cu+Sn layer when driving a displaydevice. Such a scratch causes defect due to generation or spreading offoreign substance. Particularly, a Cu chunk flows out when a penal and adriving IC are assembled. It may cause decreasing predictability of apanel manufacturing process and reliability thereof due to suchincrement of defects.

BRIEF SUMMARY

Accordingly, an aspect of the present invention is to solve at least theproblems and disadvantages of the background art. In an embodiment ofthe present invention, a Cu layer or a metal layer is not formed aroundsprocket holes where friction is generated by a driving roller during aprocess of assembling a driver IC, a Chip/drive IC, and a panel.Accordingly, foreign substance such as Cu particle is not generated.Further, a thickness of a region exposing a base film is thicker thanthat of a region not exposing a base film. Accordingly, a factor causingshort-circuit is eliminated, and a reliable TAB tape can bemanufactured.

In accordance with an aspect of the present invention, a method formanufacturing a Tape Automated Bonding (TAB) tape includes: forming acircuit pattern region including an input/output terminal pattern on abase film; forming an exposing region for exposing a surface of the basefilm at a convey region, wherein the convey region includes sprocketholes formed at the base film.

The forming a circuit pattern region may include: stacking a seed metallayer or a conductive metal layer on the base film; and forming acircuit pattern through selectively etching the conductive metal layer.

The forming a circuit pattern region may further include: after theforming a circuit pattern through selectively etching, removing the seedmetal layer from a region not having the circuit pattern formed thereonin the convey region.

In the removing the seed metal layer, the seed metal layer may beremoved through an etching solution, and the etching solution includesNi or Cr components.

In the forming a circuit pattern region and the forming an exposingregion, an exposing region for exposing the base film may besimultaneously formed by coating a photoresist and carrying out anexposing process using a photo mask having a predetermined pattern forselectively removing the circuit pattern and the convey region.

In the exposing a surface, the seed metal layer and the conductive metallayer are etched to form a metal pattern at an outer side of thesprocket holes in the convey region.

The method may further include: after the forming a circuit patternregion and the forming an exposing region, etching partially the exposedsurface of the base film.

The base film may be a polyimide film.

The method may further include: performing a surface activating processfor forming a single plating process layer or a multiple layered platingprocess layer on the circuit pattern using Cu, Ni, Pd, Au, Sn, Ag, Co,and combination thereof.

In accordance with another aspect of the present invention, a TapeAutomated Bonding (TAB) tape includes: a circuit pattern regionincluding an input/output terminal pattern formed on a base film; and aconvey region including sprocket holes formed at both sides of the basefilm, wherein the convey region includes an exposing region for exposingthe base film.

A thickness of a region exposing the base film or a thickness of aregion exposing the convey region may be thinner than a region notexposing the base film.

A seed metal layer including Ni or Cr may be disposed between thecircuit pattern and the base film.

The TAB tape may further include: a plating process layer formed on thecircuit pattern as a single plating process layer or a multiple layeredplating process layer using Cu, Ni, Pd, Au, Sn, Ag, Co, and combinationthereof.

The exposing region at the convey region may further include a metalpattern formed at outer sides of the sprocket holes.

The metal plating layer pattern may be adjacent to the sprocket hole.

The metal plating layer pattern may be separated from the sprocket hole.

The pattern region may include at least one line type metal patternseparated from the sprocket hole.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be described in detail with reference to thefollowing drawings in which like numerals refer to like elements.

FIG. 1 is a diagram illustrating a typical TAB tape package.

FIG. 2 is a diagram illustrating a TAB tape according to an exemplaryembodiment of the present invention.

FIGS. 3 and 4 are diagrams illustrating a method for manufacturing a TABtape according to an exemplary embodiment of the present invention.

FIG. 5 is a cross-section view of a TAB tape according to an exemplaryembodiment of the present invention.

FIG. 6 is a cross-section view of a TAB tape according to anotherexemplary embodiment of the present invention.

FIG. 7 is an enlarged view of a convey region of a TAB tape according toan exemplary embodiment of the present invention.

FIG. 8 is a picture illustrating foreign substance generated in a conveyregion of a TAB tape according to an embodiment of the presentinvention.

DETAILED DESCRIPTION

Preferred embodiments of the present invention will be described in amore detailed manner with reference to the drawings.

It is an object of the present invention to provide a TAB tape thatimproves reliability of a product by fundamentally preventing thegeneration of metal particles by forming exposing regions exposing abase film through selectively etching and removing a metal layer of aconvey region formed at both side of a TAB tape and having a sprockethole, and that prevents short-circuit by partially removing a base filmat a predetermined region not having a circuit pattern formed thereonthrough etching.

In order to prevent the generation of metal particles and short-circuit,a method for manufacturing a TAB tap according to an exemplaryembodiment includes forming a circuit pattern region having input/outputterminal pattern on a base film, and forming an exposing region at aconvey region having a sprocket hole for exposing the base film.

A TAB tape manufactured by the manufacturing method according to anexemplary embodiment of the present invention includes: a circuitpattern region including an input/output terminal pattern formed on abase film; and a convey region including sprocket holes formed at bothsides of the base film. The convey region includes an exposing regionfor exposing the base film. In this case, a thickness of a regionexposing the base film or a thickness of a region exposing the conveyregion is thinner than a region not exposing the base film.

Hereinafter, the present invention will be describe more fully withreference to the accompanying drawings, in which exemplary embodimentsof the present invention. The drawings and description are to beregarded as illustrative in nature and not restrictive. Like referencenumerals designate like elements throughout the specification.

FIG. 2 is a diagram schematically illustrates a TAB tape according to anexemplary embodiment of the present invention. FIG. 2 shows generalconfiguration of a TAB tape. Particularly, a TAB tape includes a conveyregion x having sprocket holes 150. The TAB tape according to thepresent exemplary embodiment can be used for both of a TCP structure anda COF structure. Particularly, the TAB tape according to the presentexemplary embodiment will be described to be used for a COF package.

The TAB tape according to the present exemplary embodiment includes anoutput circuit pattern 130, an input circuit pattern 140, an inner leadregion 120 where a chip is mounted, and a convey region x havingsprocket holes 150 for a conveying process by a roll.

The convey region x according to the present exemplary embodiment issignificantly different from a typical convey region in a view of layersforming the convey region. The convey region x according to the presentexemplary embodiment includes a region exposing a base film. That is,the convey region x according to the present exemplary embodimentincludes a region where a Cu metal pattern layer or a Sn metal patternlayer is not formed. Accordingly, the foreign substance problem issignificantly reduced.

FIGS. 3 and 4 are diagrams illustrating a method for manufacturing a TABtape according to an exemplary embodiment of the present invention. Asshown, a method for manufacturing a TAB tape according to the presentexemplary embodiment includes forming a circuit pattern region having aninput/output terminal pattern on a base film, and forming an exposingregion that exposes a surface of the base film at the convey regionhaving sprocket holes formed an outer side of the base film.

First Embodiment (1) Forming a Circuit Pattern and an Exposing Region ofa Convey Period

Referring to FIG. 4, a seed metal layer 111 or a conductive metal layer112 is formed on a base film 110. At step S1, the seed metal layer 111or the conductive metal layer 110 is formed until the convey region x.The convey region x includes sprocket holes H. The sprocket holes H areformed by a mechanical punching process. The base film 110 may be apolyimide film, a polyamide film, polyester, polyphenylene sulphide(PPS), poly ester amide, or liquid crystal polymer. Particularly, aninsulating film such as a polyimide film is used as the base film in thepresent exemplary embodiment of the present invention. The insulatingfilm such as a polyimide film is not easily deformed by heat generatedwhen a seed metal layer is formed. Further, the insulating film such asthe polyimide film has acid resistance and alkali resistance property.Accordingly, the insulating film is not eroded away by an etchingsolution used for etching or an alkali solution used for cleaning.Moreover, the insulating film has heat-resisting property. Accordingly,the insulating film is not easily deformed by heat generated when a seedmetal layer is formed.

In the present exemplary embodiment of the present invention, the seedmetal layer is formed on the base film. However, the seed metal layermay be omitted because the seed metal layer is disposed only forimproving adherence of the base film and the conductive metal layer. Theseed metal layer may be formed on the polyimide using a dry film formingmethod such as deposition or sputtering. The seed metal layer improvesthe adherence of the base film and the conductive metal layer.

At step S2, a photoresist 113 is deposited on the conductive metal layer112 and a circuit pattern is formed through exposure using the photomask 114 as medium. In the step S2, a predetermined part of thephotoresist corresponding to the convey region is removed throughshielding during exposure (It is obvious that the corresponding part ofthe photoresist is removed through exposure when a negative photoresistis used). A predetermined part of photoresist pattern may be remainedthrough a predetermined pattern when a metal pattern plating layer isformed at the convey region x.

At step S3, the circuit pattern is formed by selectively etching theconductive metal layer 112 using the patterned photoresist 113 asmedium. Although the accompanying drawings show that the entireconductive metal layer corresponding to the convey region is removed, apredetermined metal pattern may be remained through selective etchingwhen a predetermined metal pattern is formed around sprocket holes.

An etching solution for etching Cu component may be used. For example,the etching solution may be an etching solution having ferric chlorideas major component, an etching solution having cupric chloride as majorcomponent, or sulfuric acid+hydrogen peroxide. Such etching solution hasa function for easily removing the seed metal layer by finely etching apredetermined part of the seed metal layer.

(2) Removing a Seed Metal Layer

At step S4, a predetermined part of the seed metal layer, which does nothave the circuit pattern formed thereon, may be removed as shown in FIG.4. Furthermore, the seed metal layer is completely removed from theconvey region x to expose the base film. Or, the seed metal layer ispartially removed from the convey region x to expose the base film. Inthis case, the seed metal layer is not removed from a part having ametal pattern formed thereon.

The seed metal layer is made of a metal layer Ni or Cr in the exemplaryembodiment of the present invention. Accordingly, an etching solutionthat can remove Ni and Cr is used. Such an etching solution may includea composing solution of sulfuric acid and hydrochloric acid, an aqueoussolution of potassium permanganate.KOH, an aqueous solution of potassiumbichromate, and an aqueous solution of sodium permanganate+NaOH.

As described above, various TAB tapes may be manufactured through themanufacturing method according to the exemplary embodiment of thepresent invention. That is, the generation of foreign substances can besignificantly reduced by forming the exposing regions for exposing thebase film through selectively or entirely removing the metal layer orthe metal plating layer of the convey region. In detail, the metalpattern is formed at an outer area of the sprocket hole and thepredetermined pattern is formed to be close to or to be separated fromthe sprocket hole. That is, the exposing region is formed to expose thebase film except a metal pattern formed for providing a mechanicalstrength required for a base film convey operation through a roll. It isobvious that modifications of patterns of the exposing region areincluded in the scope of the present invention.

Second Embodiment Including a Process of Etching a Base Film Etching aBase Film

As described above, the TAB tape for obtaining a required mechanicalstrength and minimizing the generation of metal foreign substance can bemanufactured through the step S4. Hereinafter, a method formanufacturing a TAB tape according to another exemplary embodiment ofthe present invention will be described. That is, a process of etchingthe base film is additionally included after the step S4.

That is, the process of etching a predetermined part of the base film isperformed by controlling the etching solution such as an aqueoussolution of potassium permanganate-KOH, an aqueous solution of potassiumbichromate, and an aqueous solution of sodium permanganate+NaOH.However, the present invention is not limited to the etching solutions.

Referring to FIG. 4, after forming the circuit pattern and the exposingregion of the convey region at the steps S1 to S4, the base film isremoved through etching the exposed surface of the base film 110 usingan etching solution at the step S5. That is, the base film is partiallyremoved except the region of the base film where the circuit patternformed thereon. Accordingly, a thickness of a part having the circuitpattern formed thereon becomes different from a thickness of other partnot having the circuit pattern formed thereon. In detail, a part nothaving the circuit pattern becomes further thinner. Accordingly, thecircuit pattern can be prevented from short-circuit.

In case of a TAB tape including the metal seed layer, the base film maybe removed simultaneously when the seed metal layer is removed using theetching solution. In case of a TAB tape not including a seed metallayer, the base film may be etched through an additional process usingthe etching solutions.

FIGS. 5 and 6 are cross-section views of TAB tape manufactured throughthe manufacturing method according to the second embodiments of thepresent invention.

The TAB tape includes a circuit pattern region including an input/outputterminal pattern 112 formed on a base film 110 and a convey region xhaving sprocket holes H formed at both sides of the base film.Particularly, the convey region includes an exposing region. Theexposing region exposes a predetermined part of the base film.

As shown, the convey region is not covered by a metal layer. There is noa metal layer formed around the sprocket holes. Accordingly, metalforeign substance is not generated when a conveying process isperformed.

The base film 110 of the TAB tape according to the exemplary embodimentof the present invention may have a uniform thickness as shown in thestructure of the step S4. However, in case of additionally performingthe step S5 for etching the base film, the thickness B of a regionexposing the base film in the circuit pattern region or the thickness Cof the exposing region of the convey region is thinner than a thicknessA of a region not exposing the base film.

A seed metal layer 111 may be disposed between the circuit pattern 112and the base film 110. The seed metal layer may be formed of copper,nickel, chrome, molybdenum, tungsten, silicon, palladium, titanium,vanadium, steel, cobalt, manganese aluminum, zinc, tin, tantalum, orcombination thereof. The seed metal layer may be formed of one of theabove metals or the combination thereof. The seed metal layer ispreferably made of nickel, chrome, or combination thereof.

Further, a single plating processing layer (not shown) or a multiplelayered plating processing layer (not shown) may be additionally formedon the circuit pattern 112 through a surface activation process. Forexample, the single plating processing layer and the multiple layeredplating processing layer may be formed of Cu, Ni, Pd, Au, Sn, Ag, Co, orcombination thereof.

When a predetermined metal pattern 170 is formed at the convey region xas shown in FIG. 6, the metal pattern is formed at an outer side of thesprocket holes H. As described above, the thickness C of the base filmexposed at the convey region becomes thinner than that of the base filmnot exposed at the convey region where no metal pattern is formed in theconvey region.

FIG. 7 illustrates a method of manufacturing a convey region x inaccordance with an embodiment of the present invention.

Referring to a diagram (a), a convey region x includes an exposingregion 160 exposing a base film and sprocket holes 150 formed at apredetermined gap. At least one plating line 170 may be formed at apredetermined distance separated from the sprocket hole. That is, ametal plating layer pattern may be formed around the sprocket hole. Inthe present embodiment, the metal pattern is formed as the plating line170.

Referring to a diagram (b), a metal pattern 171 is formed to surroundthe sprocket hole. Although the metal pattern 171 is completely surroundthe sprocket hole 150 in the diagram (b), the metal pattern 171 may beformed to partially surround the sprocket hole 150.

That is, the metal pattern according to the exemplary embodiment isformed at the outer side of the sprocket hole. Such a metal patternincludes a pattern structure close to the sprocket hole and a patternstructure separated from the sprocket hole. That is, an exposing regionis formed for exposing the base film except regions having the metalpattern formed thereon for providing the mechanical strength requiredfor conveying the base film by selectively removing the metal layerentirely formed on the convey region. It is obvious that variousmodifications of the exposing region may be made within the scope of thepresent invention.

Regarding to a diagram (c), as the metal plating pattern, a plating line172 is formed to be adjacent to an outer side of a sprocket hole. Theentire convey region may be formed as the exposing region by removingthe metal layer of the conveying region as shown in a diagram (d).

In this case, the required mechanical strength may be secured bycontrolling the thickness of the base film.

FIG. 8 is an image of a real TAB tape manufactured by a manufacturingmethod according to an exemplary embodiment of the present invention.

Regarding a diagram (a), a left picture illustrates a type TAB tapehaving a Cu layer or a Cu+Sn layer formed on a convey region X1. A rightpicture shows that a significant amount of foreign substances isgenerated around sprocket holes.

Regarding a diagram (b), a left picture illustrates that an exposingregion is formed at a convey region X2 and a metal plating layer patternis formed as a plating line according to an exemplary embodiment of thepresent invention. A right picture shows metal foreign substance such asSn is not significantly generated.

Regarding a diagram (c), a left picture illustrates that an exposingregion is formed at a convey region X3 and a metal plating layer patternis formed around a sprocket hole. A right picture shows that metalforeign substance such as Sn is not significantly generated.

Regarding a diagram (d), a left picture illustrates that a metal layerof a convey region X4 is entirely removed. A right picture shows thatmetal foreign substance such as Sn is not significantly generated.

The foregoing exemplary embodiments and aspects of the invention aremerely exemplary and are not to be construed as limiting the presentinvention. The present teaching can be readily applied to other types ofapparatuses. Also, the description of the exemplary embodiments of thepresent invention is intended to be illustrative, and not to limit thescope of the claims, and many alternatives, modifications, andvariations will be apparent to those skilled in the art.

According to an embodiment of the present invention, a Cu layer or ametal layer is not formed around sprocket holes where friction isgenerated by a driving roller during a process of assembling a driverIC, a Chip/drive IC, and a panel. Accordingly, foreign substance such asCu particle is not generated, and a reliable product can bemanufactured.

Further, according to an embodiment of the present invention, athickness of a region exposing a base film is thicker than that of aregion not exposing a base film. Accordingly, a factor causingshort-circuit is eliminated, and a reliable TAB tape can bemanufactured.

1. A method for manufacturing a Tape Automated Bonding (TAB) tapecomprising: forming a circuit pattern region including an input/outputterminal pattern on a base film; forming an exposing region for exposinga surface of the base film at a convey region, wherein the convey regionincludes sprocket holes formed at the base film.
 2. The method of claim1, wherein the forming a circuit pattern region includes: stacking aseed metal layer or a conductive metal layer on the base film; andforming a circuit pattern through selectively etching the conductivemetal layer.
 3. The method of claim 2, wherein the forming a circuitpattern region further includes: after the forming a circuit patternthrough selectively etching, removing the seed metal layer from a regionnot having the circuit pattern formed thereon in the convey region. 4.The method of claim 3, wherein in the removing the seed metal layer, theseed metal layer is removed through an etching solution, and the etchingsolution includes Ni or Cr components.
 5. The method of claim 3, whereinin the forming a circuit pattern region and the forming an exposingregion, an exposing region for exposing the base film is simultaneouslyformed by coating a photoresist and carrying out an exposing processusing a photo mask having a predetermined pattern for selectivelyremoving the circuit pattern and the convey region.
 6. The method ofclaim 5, wherein in the exposing a surface, the seed metal layer and theconductive metal layer are etched to form a metal pattern at an outerside of the sprocket holes in the convey region.
 7. The method of claim1, further comprising: after the forming a circuit pattern region andthe forming an exposing region, etching partially the exposed surface ofthe base film.
 8. The method of claim 7, wherein the base film is apolyimide film.
 9. The method of claim 7, further comprising: performinga surface activating process for forming a single plating process layeror a multiple layered plating process layer on the circuit pattern usingCu, Ni, Pd, Au, Sn, Ag, Co, and combination thereof.
 10. A TapeAutomated Bonding (TAB) tape comprising: a circuit pattern regionincluding an input/output terminal pattern formed on a base film; and aconvey region including sprocket holes formed at both sides of the basefilm, wherein the convey region includes an exposing region for exposingthe base film.
 11. The TAB tape of claim 10, wherein a thickness of aregion exposing the base film or a thickness of a region exposing theconvey region is thinner than a region not exposing the base film. 12.The TAB tape of claim 11, wherein a seed metal layer including Ni or Cris disposed between the circuit pattern and the base film.
 13. The TABtape of claim 12, further comprising: a plating process layer formed onthe circuit pattern as a single plating process layer or a multiplelayered plating process layer using Cu, Ni, Pd, Au, Sn, Ag, Co, andcombination thereof.
 14. The TAB tape of claim 10, wherein the exposingregion at the convey region further includes a metal pattern formed atouter sides of the sprocket holes.
 15. The TAB tape of claim 14, whereinthe metal plating layer pattern is adjacent to the sprocket hole. 16.The TAB tape of claim 14, wherein the metal plating layer pattern isseparated from the sprocket hole.
 17. The TAB tape of claim 14, whereinthe pattern region includes at least one line type metal patternseparated from the sprocket hole.